3M™ Wafer De-Taping Tape 879

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3M™ Wafer De-Taping Tape 879

3M™ Wafer De-Taping Tape 879

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Part Number 8793M ID EMMDM2WaferDetapingTape879

 

  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power

 

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点击次数:  更新时间:2016-08-08 17:11:58  【打印此页】  【关闭