3M™ Wafer De-Taping Tape 3305

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3M™ Wafer De-Taping Tape 3305

3M™ Wafer De-Taping Tape 3305

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Part Number 33053M ID EMMDM2WaferDetapingTape3305

 

  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power

 

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点击次数:  更新时间:2016-08-09 10:23:12  【打印此页】  【关闭